Jin10 Data, August 28 - Kexiang Co., Ltd. stated on the interactive platform that in the high-end HDI field, the company has mastered 16-layer arbitrary layer interconnection technology and 30-45μm ultra-thin PP bonding technology. Currently, it has achieved laser blind hole diameters of 75±10μm, X-hole sizes of 75-100μm, line width and spacing of 50/50μm, blind hole plating aspect ratio of 0.8:1, and blind hole alignment accuracy of 50μm, among other technologies. The company will also continue to increase R&D investment in HDI products, enhance manufacturing capabilities, and match the latest technological developments with the demands for PCB products.
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Kexiang Co., Ltd.: In the field of advanced HDI, the company has mastered 16-layer arbitrary layer interconnection technology.
Jin10 Data, August 28 - Kexiang Co., Ltd. stated on the interactive platform that in the high-end HDI field, the company has mastered 16-layer arbitrary layer interconnection technology and 30-45μm ultra-thin PP bonding technology. Currently, it has achieved laser blind hole diameters of 75±10μm, X-hole sizes of 75-100μm, line width and spacing of 50/50μm, blind hole plating aspect ratio of 0.8:1, and blind hole alignment accuracy of 50μm, among other technologies. The company will also continue to increase R&D investment in HDI products, enhance manufacturing capabilities, and match the latest technological developments with the demands for PCB products.